120-M-227-SMD
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RoHS WEEE Pb free surface compliant
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| Description |
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US Patent 6966795
The solder retention devices (SMT anchors) provide an exceptionally high retention force for the terminal block to the PCB. The most significant benefit of this design is the protection it provides to the solder joints against stresses encountered in field-installations. This is the strongest SMT retention method in the industry. The anchoring element constitutes a Universal SMT retention method (can be licensed for other applications). It eliminates completely CTE mismatch (Coefficient of thermal expansion) and provide total coplanarity (contains position adapting pin). Removable thermo resistant pick caps are supplied when packed in tape and reel. This allows automated pick place applications.
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| Plug-In Direction Perpendicular to PCB and Wire Entrance Parallel to PCB when plugged with 120-D-111, 120-D-121 |
| Plug-In Direction and Wire Entrance Perpendicular to PCB when plugged with 120-A-111 |
| Typical pull off forces 50 kg per module (depending on soldering process). |
| Typical peel off forces 30 kg per module (depending on soldering process). |
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| Technical Data |
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Center to Center Spacing: 5 mm (0.197 in.)
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| Dimensions: mm (in.) |
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Length of Connector (L)
L = No. of Poles x Center to Center Spacing + 14 mm
(A)
(B) Recommended Stencil Thickness 0.15 mm (0.006 in.)
(C) PCB Pad layout |
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| Approval Information |
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UL File No.E69841  |
| CSA File No.LR24322 |
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Rating
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Current(A)
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Voltage(V)
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Application
group
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AWG
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| UL |
15 |
300 |
B |
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| UL |
10 |
300 |
D |
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| CSA |
15 |
300 |
B |
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| CSA |
10 |
300 |
D, E |
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| Material |
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Molding: Polyamide 4.6, 30% GF (glass fiber reinforced), self extinguishing UL 94, V-0, color grey
Temperature limits:
Short Time: 250°C (482°F)
Continuous: RTI 105°C (221°F)
Low Limit: -40°C (-40°F)
Comparative Tracking Index: CTI≥600V
Oxygen Index Rating: 33%
Solder Pin: 1 x 1 mm (0.04 x 0.04 in.), Tin plated copper alloy
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