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RoHS WEEE Pb free surface compliant
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| Description |
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U.S. Pat.6224399B1
 | Pinstrip |
| Low profile |
| Exceptional pin retention force on SMT |
| Typical resistance to horizontal peel off force per 2 poles 15 kgf (33 lbf) per 6 poles 28 kgf (61 lbs) (depending on soldering process). |
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| Technical Data |
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Center to Center Spacing: 5 mm (0.197 in.)
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| Dimensions: mm (in.) |
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Length of Connector (L)
L = No. of Poles x Center to Center Spacing
(A) Odd numbers of poles
(B) Even numbers of poles
(C) PCB Pad layout
Recommended Stencil Thickness 0.15 to 0.20 mm (0.006 to 0.008 in.) |
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| Approval Information |
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UL File No.E69841  |
CSA File No.LR24322  |
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Rating
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Current(A)
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Voltage(V)
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Application
group
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AWG
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| UL |
10 |
300 |
B |
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| CSA |
10 |
300 |
B |
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| Material |
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Molding: HT Polyamide, self extinguishing UL 94, V-0, color Black
Temperature limits:
Short Time: 260°C (500°F), 15-30 sec
Continuous: RTI 105°C (221°F)
Low Limit: -40°C (-40°F)
Comparative Tracking Index: CTI≥600V
Oxygen Index Rating: 37 %
Average weight per pole: 0.1 gram per pole,
Solder Pin: Ø 1.1 mm (0.04 in.), Tin plated copper alloy
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