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RoHS WEEE Pb free surface compliant
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| Description |
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US Patent # 6.224.399 B1
Canadian Patent # 2307922
Material will handle RoHS complying reflow temperatures without deforming or melting.
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| Excellent coplanarity better than 0.13 mm |
| Typical resistance to vertical pull off force per pin 10 kg (depending on soldering process). |
| Typical resistance to horizontal peel off force per pin 3 kg (depending on soldering process). |
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| Technical Data |
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Center to Center Spacing: 5 mm (0.197 in.)
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| Application |
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You can now convert one more component on your board to a genuine surface mount. You can increase packaging accuracy and component density, use both sides of the PCB, reduce and eliminate set-up costs and simplify and streamline your processes.
The patented 971-SLR-SMD "nail head" pin design ensures a secure and reliable contact with the printed circuit board. The 0.15 mm co-planarity tolerance of this pin strip allows reliable soldering to PCB approaching zero defects for this characteristic and its effects. Plastic thermo resistant caps ensure automated pick & place-ability for both odd and even pole versions. (Consult our “Tape & Reel Data” table within our Technical Information section for details.
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| Dimensions: mm (in.) |
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Length of Connector (L)
L = No. of Poles x Center to Center Spacing - 0.6 mm
(B) Removable vacuum pick surface
(C) Recommended pad footprint
(D) Recommended Stencil Thickness 0.15 to 0.20 mm (0.006 to 0.008 in.) |
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| Approval Information |
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UL File No.E69841  |
CSA File No.LR24322  |
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Rating
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Current(A)
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Voltage(V)
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Application
group
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AWG
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| UL |
10 |
300 |
B |
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| CSA |
10 |
300 |
B |
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| Material |
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Molding: HT Polyamide, self extinguishing UL 94, V-0, color black
Temperature limits:
Short Time: 260°C (500°F), 15-30 sec
Continuous: RTI 105°C (221°F)
Low Limit: -40°C (-40°F)
Comparative Tracking Index: CTI≥600V
Oxygen Index Rating: 35%
Average weight per pole: 0.04 gram per pole,
Solder Pin: Ø 1.1 mm (0.04 in.), Tin plated copper alloy
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