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RoHS WEEE Pb free compliant
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| Description |
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Standoffs underneath the molding prevent bottom of molding from touching the solder paste and allow for a visual inspection of the solder joints and better air flow during the reflow soldering process. Material will handle reflow temperatures well without deforming or melting.
 | Through Hole Reflow |
| Wire entrance parallel to PC Board |
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| Technical Data |
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Center to Center Spacing: 3.5 mm (0.138 in.)
Nominal Cross Section:
1 mm2 (1550 mils2)
Wire Stripping Length: 6 mm (0.25 in.)
Recommended Hole Diameter in PC Board:
1.3 mm (0.051 in.)
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| Application |
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WECO's THR designs are adapted for easy integration into your processes. Standoffs provide for good convective heat circulation for reliable soldering through the elimination of cold spots and also allow for a visual inspection of the solder joints. The main advantage of through-hole terminal blocks is their reliable mechanical strength. This robustness is particularly important for applications exposed to harsh environments or strong vibrations such as mobile equipment, engine or motor compartments.
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| Dimensions: mm (in.) |
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| Approval Information |
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UL File No.E69841  |
CSA File No.LR24322  |
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Rating
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Current(A)
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Voltage(V)
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Application
group
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AWG
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| UL |
10 |
300 |
B |
26-16 |
| CSA |
7 |
300 |
B,E |
26-16 |
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* DS version is CSA certified for 26-18 AWG
Screw Tightening Torque:
UL: 2.0 lfbin
CSA: 0.2 Nm
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| Material |
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Molding: Polyamide 4.6, 30% GF (glass fiber reinforced), self extinguishing UL 94, V-0, color black
Temperature limits:
Short Time: 260°C (500°F)
Continuous: RTI 105°C (221°F)
Low Limit: -40°C (-40°F)
Comparative Tracking Index: CTI > 250
Oxygen Index Rating: 37%
Terminal Body: Tin plated copper alloy
Wire Protector: Nickel silver
Screw: M2, Slotted head, zinc plated blue passivated, steel substrate
Solder Pin: Ø 0.9 mm (0.035 in.), Tin plated copper alloy
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