971-SLK-SMD
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One possible variation of assembly
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RoHS WEEE Pb free compliant
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| Description |
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US Patent # 6.224.399 B1brCanadian Patent # 2307922brMaterial will handle RoHS complying reflow temperatures without deforming or melting.
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| Excellent coplanarity better than 0.13 mmbrTypical resistance to vertical pull off force per pin 10 kg (depending on soldering process). brTypical resistance to horizontal peel off force per pin 3 kg (depending on soldering process). |
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| Technical Data |
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Center to Center Spacing: 5 mm (0.197 in.)
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| Application |
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You can now convert one more component on your board to a genuine surface mount. You can increase packaging accuracy and component density, use both sides of the PCB, reduce and eliminate set-up costs and simplify and streamline your processes.
The patented 971-SLK-SMD "nail head" pin design ensures a secure and reliable contact with the printed circuit board. The 0.15 mm co-planarity tolerance of this pin strip allows reliable soldering to PCB approaching zero defects for this characteristic and its effects. Plastic thermo resistant caps ensure automated pick & place-ability for both odd and even pole versions. (Consult our “Tape & Reel Data” table within our Technical Information section for details.
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| Dimensions: mm (in.) |
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| Length of Connector (L)brL = No. of Poles x Center to Center Spacingbr(B) Removable vacuum pick surfacebr(C) Recommended pad footprintbr(D) Stencil thickness |
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| Approval Information |
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UL File No.E69841  |
CSA File No.LR24322  |
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Rating
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Current(A)
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Voltage(V)
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Application
group
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AWG
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| UL |
10 |
300 |
B |
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| CSA |
10 |
300 |
B |
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| Material |
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Molding: Polyamide PA4.6 , 30% GF (glass fiber reinforced), self extinguishing UL 94, V-0, color white
Temperature limits:
Short Time: 240°C (464°F)
Continuous: RTI 105°C (221°F)
Low Limit: -40°C (-40°F)
Comparative Tracking Index: CTI > 250
Oxygen Index Rating: 28%
Solder Pin: Ø 1.1 mm (0.04 in.), Tin plated copper alloy
Average weight: 0.04 gram,
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